Temporary Bonder
●Model: BND_SA
●Application: Wafer bonding in Compound
●Tool Specification:
■Bonding Chamber: 1ea
■Wafer Bonding Offset: ≤0.4mm
■Chamber Vacuum: ≤0.5torr
■Bonding Force: ≤200kg
■Temperature control:
◆Top plate: ≤max. 200°C, Temp. Uniformity ±2.5%
◆Bottom plate: ≤max. 250°C, Temp. Uniformity ±2.5%
■Control interface: HMI