Temporary Bonder

●Model: BND_SA

●Application: Wafer bonding in Compound

●Tool Specification:

■Bonding Chamber: 1ea

■Wafer Bonding Offset: ≤0.4mm

■Chamber Vacuum: ≤0.5torr

■Bonding Force: ≤200kg

■Temperature control:

◆Top plate: ≤max. 200°C, Temp. Uniformity ±2.5%

◆Bottom plate: ≤max. 250°C, Temp. Uniformity ±2.5%

■Control interface: HMI