Developer

●Model: DEV_SA

●Application: Developer

●Tool Specification:

■Wafer or Panel

■Process Chamber: 1ea

■Spin chuck: vacuum

■Process arm: 3ea

■Top side rinse : 2ea

■Bottom side rinse : 1ea

■N2 Blow drying

■Water mark free、Scratch free

■PA Specification: <30ea@0.2um

■Control interface: HMI

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