Cleaner

●Model: CLN_SA

●Application: Single Wafer Spin Clean

●Tool Specification:

■Chemical inline mixing function

■Chemical Temperature Control(RT~80℃ ; ±2℃)

■Max . Reclaim Cup: 3ea; Chemical reclaim ratio>95%

■Process arm swing speed control(Swing arm profile)

■A/B tank auto switch(PLC)

■Auto chemical suck back function(Chemical drop prevention)

■Auto chemical flow rate control

■2-Fluid cleaning

■N2 Blow drying

■Water mark free、 Scratch free

■Dry in/ Dry out

■PA Specification: <30ea@0.2um

■Control interface: HMI