Debonder

●Model: DEB_SA

●Application: Wafer bonding in Compound

●Tool Specification:

■Debonding Module: 1 set

■Temperature control: ≤max. 350°C

■Temp. Uniformity ±2.5%

■Debonding speed: 0.3~10mm/sec, control by step motor

■Control interface: HMI