Scrubber

●Model: SCR

●Application: Single Wafer Spin Scrubber

●Tool Specification:

■Wafer Size: 4"/ 6"/ 8"

■Process Chamber: 1ea

■Hi-jet clean nozzle : Fan type or Needle type

■Hi jet pressure : 750~3000psi(Depend on Process requirement)

■2-Fluid cleaning

■Brush or Megasonic cleaning(Optional)

■N2 Blow drying

■Water mark free 、 Scratch free

■Dry in/ Dry out

■PA Specification: <30ea@0.2um

■Control interface: HMI